Colossal dielectric response and relaxation behavior in novel system of Zr4+ and Nb5+ co-substituted CaCu3Ti4O12 ceramics

In this work, we developed a novel system of isovalent Zr⁴⁺ and donor Nb⁵⁺ co-doped CaCu₃Ti₄O₁₂ (CCTO) ceramics to enhance dielectric response. The influences of Zr⁴⁺ and Nb⁵⁺ co-substituting on the colossal dielectric response and relaxation behavior of the CCTO ceramics fabricated by a conventional solid-phase synthesis method were investigated methodically. Co-doping of Zr⁴⁺ and Nb⁵⁺ ions leads to a significant reduction in grain size for the CCTO ceramics sintered at 1060 °C for 10 h. XRD and Raman results of the CaCu₃Ti_3.8-xZr_xNb_0.2O₁₂ (CCTZNO) ceramics show a cubic perovskite structure with space group Im-3. The first principle calculation result exhibits a better thermodynamic stability of the CCTO structure co-doped with Zr⁴⁺ and Nb⁵⁺ ions than that of single-doped with Zr⁴⁺ or Nb⁵⁺ ion. Interestingly, the CCTZNO ceramics exhibit greatly improved dielectric constant (~10⁵) at a frequency range of 10²–10⁵ Hz and at a temperature range of 20–210 °C, indicating a giant dielectric response within broader frequency and temperature ranges. The dielectric properties of CCTZNO ceramics were analyzed from the viewpoints of defect-dipole effect and internal barrier layer capacitance (IBLC) model. Accordingly, the immensely enhanced dielectric response is primarily ascribed to the complex defect dipoles associated with oxygen vacancies by co-doping Zr⁴⁺ and Nb⁵⁺ ions into CCTO structure. In addition, the obvious dielectric relaxation behavior has been found in CCTZNO ceramics, and the relaxation process in middle frequency regions is attributed to the grain boundary response confirmed by complex impedance spectroscopy and electric modulus.     

Structural Analysis of silica aerogels for the interlayer dielectric in semiconductor devices

As semiconductor devices have become miniaturized and highly integrated, interconnection problems such as RC delays, power dissipation, and crosstalk appear. To alleviate these problems, materials with a low dielectric constant should be used for the interlayer dielectric in nanoscale semiconductor devices. Silica aerogel as a porous structure composed of silica and air can be used as the interlayer dielectric material to achieve a very low dielectric constant. However, the problem of its low stiffness needs to be resolved for the endurance required in planarization. The purpose of this study is to discover the geometric effect of the electrical and mechanical properties of silica aerogel. The effects of porosity, the distribution of pores, the number of pores on the dielectric constant, and elastic modulus were analyzed using FEM. The results suggest that the porosity of silica aerogel is the main parameter that determines the dielectric constant and it should be at least 0.76 to have a very low dielectric constant of 1.5. Additionally, while maintaining the porosity of 0.76, the silica aerogel needs to be designed in an ordered open pores structure (OOPS) containing 64 or more pores positioned in a simple cubic lattice point to endure in planarization, which requires an elastic modulus of 8 GPa to prevent delamination.     

Strain hardening behaviors and mechanisms of polyurethane under various strain rate loading

The uniaxial tension experiments are performed on thermoplastic polyurethane to investigate its mechanical behaviors and related potential mechanisms, and the loading strain rate is designing to be wide ranging from 0.0001 to 1 s⁻¹. It is found that the polyurethane presents an obvious rate-dependence, and the stress strain curves share distinct strain hardening characteristics under the investigated strain rates. Furthermore, the strain hardening ratios are sharing nearly same trends and appear to be influenced by both strain rate and the induced adiabatic heating. Besides, the ratio is also strain-dependent on previous loading history. Then, a two-dimension unit cell model is built to investigate potential equivalent mechanisms, of which the hard phase as inclusion is equivalent with crystallization zone, crosslinking sites, and so forth. The simulation results facilitate to explain the distinct strain hardening ratios, even for the matrix from the extrapolated curves under super-low strain rate loading. Finally, the analogic mechanisms of equivalent hard inclusions are proposed, which can reasonably explain the strain rate- and strain-dependence characteristics of polyurethane mechanical behaviors.     

超分子作用阻尼材料的动态力学模型修正

为提高飞机起落架载荷实测精度，以支柱式起落架结构为研究对象，探讨处理其载荷标定数据的工程方法。首先，对实际受载情况和单向加载工况标定数据的分析，挖掘出三向载荷、缓冲支柱压缩行程与应变码值间的数学关系，将预测的数学关系代入到多向工况的标定数据中，验证了它们的准确性;其次，根据两种标定数据回归方法，提出了对应使用的支柱式起落架载荷-应变标定方程的数学模型;最后，将两种标定方程代回到标定数据中，计算起落架三向载荷，所有反算载荷的误差均在可控范围内，表明标定方程满足精度要求。将标定方程代入实测数据中，实测曲线符合变化规律。该处理方法的应用能有力提高支柱式起落架的起飞-着陆载荷实测和载荷谱编制的准确度。     

饱和尾粉砂动孔隙水压力发展特性试验研究

采用动三轴仪对内蒙古某尾矿库尾粉砂进行了动强度试验,研究了围压、相对密实度及固结比对动荷载作用下尾粉砂中孔隙水压力发展特性的影响。研究结果表明,随着固结比、相对密实度、围压的增大,动荷载作用下饱和尾粉砂孔压增长曲线形状由陡峭转变为平缓。随着围压及固结比增大,试样动力破坏形式从以孔压值为主要表征指标的液化破坏,转化为以动剪应变为主要破坏形式的软化破坏。动荷载作用下发生液化破坏的饱和尾粉砂孔压增长过程分可为初始增长阶段、稳定增长阶段和快速增长至破坏阶段,孔压增长曲线表现为明显的反S型,本文采用双对数函数对该试验孔压增长曲线进行拟合,结果表明该模型可以较好地模拟尾粉砂在动荷载作用下的孔压发展规律。     

退火温度对冷轧DP980钢力学性能的影响

利用连续退火模拟机对DP980试验钢进行了连续退火试验,并通过扫描电镜、电子背散射衍射、透射电镜等研究了不同退火温度下(775、800、825和850 ℃),试验钢显微组织的演变规律和力学性能的变化趋势。结果表明:试验钢的屈服强度随着退火温度的升高而不断增大(从705 MPa增大到850 MPa),抗拉强度和断后伸长率则随着退火温度的升高而不断减小(抗拉强度从1150 MPa减小到1030 MPa;伸长率从8.9%减小到5.3%),这与试验钢的显微组织构成和形态分布密切相关。此外,不同退火温度下,试验钢的加工硬化率曲线均呈现单调下降的趋势。     

DP980+Z烘烤硬化值与退火温度的关系

摘要：为了研究退火温度对镀锌DP980+Z烘烤硬化值的影响，退火温度控制在760～820℃之间，系统分析退火温度对烘烤硬化值的影响。通过准静态拉伸试验机测量烘烤硬化值及抗拉强度，采用lepara试剂对组织中的马氏体进行着色，利用金相显微镜及图像处理软件测量马氏体的体积分数；采用扫描电镜观察DP980+Z的双相组织特点，并且将组织图片通过CAD转化成有限元图进行网格划分，建立代表性体积单元（RVE），通过有限元分析铁素体、马氏体强度对烘烤硬化值的影响。在同样的变形量情况下，DP980+Z的原始屈服强度越高，烘烤硬化值越高。     

基于P波模量的原位胶结充填体强度预测模型研究

原位胶结充填体质量评价通常采用单轴抗压强度作为表征指标,由于在现场工程中无法快速、准确获取充填体的强度值,因此需要建立一种参数易于获取且准确的原位胶结充填体强度预测模型。基于胶结充填体物理力学参数的内在联系,从量纲平衡的角度探索了胶结充填体单轴抗压强度与P波模量的关系。根据C矿和I矿两种原位胶结充填体的密度、P波速度及取芯强度的测试数据,采用线性拟合的方法获得了基于P波模量的原位胶结充填体强度预测模型。通过对C矿和I矿的强度预测模型拟合效果分析可知,P波模量与取芯强度呈正相关性,且拟合效果较好,证明原位胶结充填体强度预测模型精度高,具有很强的实用性。     

On the origin of strain hardening in glassy polymers

The influence of network density on the strain hardening behaviour of amorphous polymers is studied. The network density of polystyrene is altered by blending with poly(2,6-dimethyl-1,4-phenylene-oxide) and by cross-linking during polymerisation. The network density is derived from the rubber-plateau modulus determined by dynamic mechanical thermal analysis. Subsequently uniaxial compression tests are performed to obtain the intrinsic deformation behaviour and, in particular, the strain hardening modulus. At room temperature, the strain hardening modulus proves to be proportional to the network density, irrespective of the nature of the network, i.e. physical entanglements or chemical cross-links. With increasing temperature, the strain hardening modulus is observed to decrease. This decrease appears to be related to the influence of thermal mobility of the chains, determined by the distance to the glass-transition temperature (T−T_g).